Product Overview

The MPU-6052C is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer,and a Digital Motion Processor™ (DMP) all in a small 4x4x0.9mm package. It also features a 512 byte FIFOthat can lower the traffic on the serial bus interface, and reduce power consumption by allowing the systemprocessor to burst read sensor data and then go into a low-power mode. With its dedicated I2C sensor bus,the MPU-6052C directly accepts inputs from external I2C devices. MPU-6052C, with its 6-axis integration,on-chip DMP, and run-time calibration firmware, enables manufacturers to eliminate the costly and complexselection, qualification, and system level integration of discrete devices, guaranteeing optimal motionperformance for consumers. MPU-6052C is also designed to interface with multiple non-inertial digitalsensors, such as pressure sensors, on its auxiliary I2C port.The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec and verylow rate noise at 0.01 dps/√Hz. The accelerometer has a user-programmable accelerometer full-scale rangeof ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors reduces production-linecalibration requirements.Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clockwith 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. Thedevice features I2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digitalIO supply, VDDIO from 1.71V to 3.6V.Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. Forapplications requiring faster communications, the sensor and interrupt registers may be read using SPI at20MHz.By leveraging its patented and volume-proven CMOS-MEMS Fabrication platform, which integrates MEMSwafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the packagesize down to a footprint and thickness of 4x4x0.9mm (24-pin QFN), to provide a very small yet highperformance low cost package. The device provides high robustness by supporting 10,000g shock reliability.